Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System

University of Strathclyde · Lab & precision equipment · Scotland

Contract value
Not stated
The buyer did not publish a figure
Deadline
34 days left
Closes 9 September 2026

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Published
6 August 2026
Sector
Lab & precision equipment
Where
Scotland

What the buyer wants

Background

The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.

The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.

NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.

Description

The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.

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